Published August 1995
by Materials Research Society .
Written in English
|Contributions||T. M. Lu (Editor), Shyam P. Murarka (Editor), T. S. Kuan (Editor), C. H. Ting (Editor)|
|The Physical Object|
|Number of Pages||288|
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. PDF | On , Yi-Lung Cheng and others published Porous Low-Dielectric-Constant Material for Semiconductor Microelectronics | Find, read and cite all the research you need on ResearchGate. Abstract To provide high speed, low dynamic power dissipation, and low cross-talk noise for microelectronic circuits, low-dielectric-constant (low-k) materials are required as the inter- and intra-level dielectric (ILD) insulator of the back-end-of-line interconnects.
Purchase Handbook of Low and High Dielectric Constant Materials and Their Applications, Two-Volume Set - 1st Edition. Print Book & E-Book. ISBN , Abstract. Dielectrics are an important class of thin-film electronic materials for microelectronics. Applications include a wide swathe of device applications, including active devices such as transistors and their electrical isolation, as well as passive devices, such as capacitors. Part of the Springer Series in Advanced Microelectronics book series (MICROELECTR., volume 9) Abstract D.Y. Yoon: “Polyimide Nanofoams for Low Dielectric Applications”, Low-Dielectric Constant Materials-Synthesis and Applications in Microelectronics (San . Volume 1 of the Handbook combines the most recent knowledge of the dielectric materials into the one focused reference source - from low dielectric constant polymers, glasses and ceramics for interlayer dielectrics to low-k amorphous carbon films for interconnections of submicron-scale devices; chemical mechanical polishing of organic polymer materials for IC : Hardcover.
Chiang C, Mack A S, Pan C, Ling Y L, Fraser D F Low Dielectric Constant Materials. Synthesis and Application in Microelectronics vol ed T M Lu, S P Murarka, T S Kuan, CH Ting p . Dielectric Materials Research for Advanced Microelectronic Devices - History. From a historical point of view, the search for new low-k and ultra low-k materials has always been dictated by industrial needs, resulting in a strong connection between fundamental research and technology. The low dielectric constant and dielectric loss, the low thermal expansion coefficient, and high thermal conductivity make these kinds of composites suitable for microelectronics packaging. The filler ratio, surface modification, and preparation methods of these composites have a marked effect on the final properties of these materials. Next generation microelectronic packaging requirements are driving the need to produce increasingly lower dielectric constant materials while maintaining high thermal stability and ease of processing. Polymer candidates with exceptionally low dielectric constant (), high thermal stability (degradation temperature.